Display apparatus

ABSTRACT

A display apparatus includes a substrate including a display area, a camera hole, and a non-display area between the display area and the camera hole, a light-emitting element disposed in the display area, one or more cut-out parts and at least one dam disposed in the non-display area, a plurality of insulating films disposed on the substrate and disposed under the light-emitting element, the cut-out parts, and the dam, and a crack prevention structure disposed between the at least one dam and the camera hole.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from Korean Patent Application No.10-2021-0169525, filed on Nov. 30, 2021, which is hereby incorporated byreference in its entirety.

BACKGROUND Field of the Disclosure

The present disclosure relates to a display apparatus, and moreparticularly, to a display apparatus in which a camera hole is disposed.

Description of the Background

Recently, as the information age has arrived, displays visuallyexpressing electrical information signals have been rapidly developed.In response to such a trend, various display apparatuses havingexcellent performance, such as a thin profile, a light weight, and lowpower consumption, have been developed.

Specific examples of such display apparatuses include a liquid crystaldisplay (LCD) apparatus, an organic light-emitting diode (OLED) displayapparatus, and a quantum dot display apparatus.

A display apparatus may include a display panel and a plurality ofcomponents for providing various functions. For example, in an existingdisplay apparatus, cameras and various optical sensors are disposed at aperipheral portion of a display panel to perform various functions suchas photographing, face recognition, and infrared distance measurementfunctions. However, through successive generations, so-called bezel-lessor bezel-free designs, in which a screen is fully filled with a displayarea when a user looks at the display apparatus, have become morecommon, which makes it difficult to arrange such cameras and opticalsensors. In order to achieve such a bezel-less or bezel-free design,research has been conducted on a method of moving cameras and opticalsensors inside a display area of a display panel. As a result of theresearch, a technology called a hole-in display (HID) has been developedin which holes can be formed in a display panel to arrange cameras andoptical sensors inside the holes in a display panel.

Although an HID has been described above in order to express that a holeis present in a display area, a hole-in active area (HiAA) may also beused in order to express that a hole is present inside an active area.

As an HID or an HiAA is developed and all cameras and sensors placed inthe existing bezel area are moved to the inside of an active area of adisplay panel, extreme bezel-less or bezel-free designs can be applied.

A display area and an active area may be synonymously to describe anarea in which a pixel is driven to emit light.

SUMMARY

The present specification is directed to solving the above-describedproblems that may occur in designing a hole-in display (HID) or hole-inactive area (HiAA) structure. Holes in which cameras or optical sensorsare disposed may be formed in a display area or an active area. In thiscase, components such as a light-emitting element or a drivingtransistor required for a display may not be disposed in a hole area,and even a substrate of a display panel may be removed from the holearea. When the substrate of the display panel or the light-emittingelement remains in the hole area, optical interference on cameras orsensors may occur, and thus, a function thereof may be degraded.

As described above, in order to remove the substrate of the displaypanel, a fine cutting process may be generally performed using a laser.When cutting is performed based on a phenomenon in which the substrateof the display panel is melted and broken by local thermal energyreceived from the laser, a large amount of energy may be accumulated ina local area of the substrate, and cracks may be generated due to theenergy accumulated in the substrate at the time of a cutting process orafter the cutting process.

Cracks generated in a cut portion of the substrate may expand or extendto a peripheral area due to stress generated as a subsequent process isperformed. Specifically, the cracks generated in the cut portion of thesubstrate may expand or extend toward a display area, and in particular,the cracks may easily propagate in an inorganic insulating film disposednear the hole area.

Cracks generated in the cut portion of the substrate in the hole area,which may be regarded as the outside of the display area, may become akind of moisture penetration path. Light-emitting elements disposed inthe display area are provided with an organic material layer or anorganic emission layer and thus have a vulnerable characteristic tomoisture. Specifically, when moisture permeates into the organicmaterial layer of the light-emitting element, an organic material reactswith the moisture to cause pixel shrinkage in which an emission area isgradually reduced or a dark spot phenomenon in which a pixelincompletely emits light. Accordingly, in order to prevent penetrationof moisture due to cracks, a crack propagation prevention structure isdisposed, thereby preventing the propagation of cracks generated in acut portion of the hole area.

A main point of the present disclosure is that, in order to design abezel-less or bezel-free display panel which is a development trend ofdisplay apparatuses, holes for arranging cameras and sensors in adisplay area are formed, and also, display quality is prevented frombeing degraded due to the holes.

In an aspect, aspects of the present disclosure may provide a displayapparatus including a substrate including a display area, a camera hole,and a non-display area between the display area and the camera hole, alight-emitting element disposed in the display area, one or more cut-outparts and at least one dam disposed in the non-display area, a pluralityof insulating films disposed on the substrate and disposed under thelight-emitting element, the cut-out parts, and the dam, and a crackprevention structure disposed between the at least one dam and thecamera hole.

In another aspect, aspects of the present disclosure may provide adisplay apparatus including a substrate including a non-display areadisposed between a camera hole and a display area, a plurality ofinorganic insulating films disposed in the display area and thenon-display area, an organic light-emitting stack disposed on theplurality of inorganic insulating films to correspond to the displayarea, one or more cut-out parts and at least one dam disposed on theplurality of inorganic insulating films to correspond to the non-displayarea, and a crack prevention structure disposed in the one or morecut-out parts.

Other detailed matters of the aspects are included in the detaileddescription and the drawings.

In a display apparatus according to aspects of the presentspecification, a camera hole can be disposed inside a display area of adisplay panel, thereby providing a display apparatus in which an overallexterior of a display panel has a slim bezel or a narrow bezel.

Therefore, a user of a display apparatus can aesthetically use a devicein which a front surface of a display apparatus is fully with alight-emitting screen, and by using a compact module that isfunctionally applied to a narrow bezel, a better sense of grip and asense of light weight can be provided to the user.

In a display apparatus according to aspects of the presentspecification, a plurality of prevention parts are formed around acamera hole, thereby preventing penetration of moisture and oxygenflowing from the camera hole. The prevention part can block a movementpath of moisture and oxygen by cutting off a connection of an organiccommon layer of a light-emitting element disposed on an entire surfaceof a display panel, that is, a light-emitting stack.

With reference to the straightness of an organic material in an organicmaterial deposition process for forming a light-emitting stack, avertical structure of a structure of a prevention part may be increasedto form a long side portion, or a width of the side portion of thestructure of the prevention part may be varied. An organic material isnot stacked or is inevitably stacked non-uniformly on an area, which isnot present in a deposition direction of the organic material throughthe side portion of the structure of the prevention part, or on the sideportion perpendicular to the deposition direction. Thus, a materialconstituting the light-emitting stack may not be stacked or may benon-uniformly stacked on the side portion of the structure of theprevention part and thus structurally separated.

A plurality of dams are disposed near the prevention part, therebypreventing an organic insulating layer of an encapsulation layer fromoverflowing into a camera hole. Through the plurality of dams, it ispossible to prevent contamination of a camera hole area and preventinterference on a camera to be disposed in the camera hole area that mayoccur when the organic insulating layer overflows to the camera hole.

Structures of a prevention part are disposed at a plurality ofpositions, thereby preventing penetration of moisture and oxygen from acamera hole, and the structures of the prevention part are formed indifferent shapes such as a positive tapered shape and a negative taperedshape to use the pros and cons of each structure, thereby obtaining moreexcellent effects of preventing moisture penetration and oxygenpenetration.

The effects of the present specification are not limited to theabove-described effects, and other effects not described above, will beapparent to a person having ordinary skill in the art from the followingdescription.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the disclosure as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and advantages of the presentdisclosure will be more apparent from the following detailed descriptiontaken in conjunction with the accompanying drawings, in which:

FIG. 1 is a view illustrating a front surface of a display panelaccording to an aspect of the present specification;

FIG. 2 is an enlarged plan view of area A of FIG. 1 which illustrates adisplay area;

FIG. 3 is a cross-sectional view along line I-I′ of FIG. 2 whichillustrates a subpixel;

FIG. 4 is an enlarged plan view of area B of FIG. 1 which illustrates acamera hole;

FIG. 5 is an enlarged plan view of area C of FIG. 4 which illustrates aperipheral portion of the camera hole;

FIG. 6 is a cross-sectional view along line III-IV of FIG. 5 whichillustrates a camera hole area;

FIG. 7 is cross-sectional views illustrating a crack preventionstructure according to another aspect of the present disclosure;

FIG. 8 is cross-sectional views illustrating a crack preventionstructure according to another aspect of the present disclosure;

FIG. 9 is cross-sectional views illustrating a crack preventionstructure according to another aspect of the present disclosure;

FIG. 10 is cross-sectional views illustrating a crack preventionstructure according to another aspect of the present disclosure;

FIG. 11 is cross-sectional views illustrating a crack preventionstructure according to another aspect of the present disclosure;

FIG. 12 is cross-sectional views illustrating a crack preventionstructure according to another aspect of the present disclosure;

FIG. 13 is cross-sectional views illustrating a crack preventionstructure according to another aspect of the present disclosure;

FIG. 14 is cross-sectional views illustrating a crack preventionstructure according to another aspect of the present disclosure; and

FIG. 15 is cross-sectional views illustrating a crack preventionstructure according to another aspect of the present disclosure.

DETAILED DESCRIPTION

The advantages and features of the present disclosure and methods foraccomplishing the same will be more clearly understood from aspects tobe described in detail below with reference to the accompanyingdrawings. However, the present disclosure is not limited to thefollowing aspects but may be implemented in various different forms. Thepresent aspects are provided only to complete the present disclosure andto fully provide the scope of the present disclosure to a person havingordinary skill in the art to which the present disclosure pertains, andthe present disclosure will be defined by the appended claims.

Shapes, sizes, ratios, angles, and numbers disclosed in the drawings fordescribing the aspects of the present disclosure are merely an examples,and thus, the present disclosure is not limited to the illustrateddetails. Like reference numerals refer to like elements throughout. Indescribing the present disclosure, when the detailed description of therelevant known function or configuration is determined to unnecessarilyobscure an important point of the present disclosure, the detaileddescription will be omitted. In a case where “comprise,” “have,” and“include” described in the present specification are used, another partmay be added unless “only” is used. Any references to singular mayinclude plural unless expressly stated otherwise.

In construing a component, the component is construed as including anerror range even if there is no explicit description.

In describing a position relationship, for example, when a positionrelation between two parts is described as “on,” “over,” “under,” or“next,” one or more other parts may be “immediately” or “directly” isused.

In describing a time relationship, for example, when the temporal orderis described as “after,” “subsequent,” “next,” or “before,” a case whichis not continuous may be included unless “immediately” or “right” isused.

It should be understood that, although terms such as “first,” “second,”and the like may be used herein to describe various components, thesecomponents are not limited by these terms. These terms are only used todistinguish one element or component from another element or component.Therefore, a first component described below could be termed a secondcomponent without departing from the scope and spirit of the presentdisclosure.

In describing the components of the present specification, terms such as“first,” “second,” “A,” “B,” “(a),” and “(b)” may be used. These termsare merely for the purpose of differentiating one component from anothercomponent, and the essence, sequence, order, or number of acorresponding element should not be limited by the terms. When acomponent is described as “connected,” “coupled,” or “linked” to anothercomponent, it may mean not only that the components are directly“connected,” “coupled,” or “linked” but also that they are indirectly“connected,” “coupled,” or “linked” through still another component.

In the present specification, a “display apparatus” may include anarrow-sense display apparatus such as a liquid crystal module (LCM), anorganic light-emitting diode (OLED) module, or a quantum dot (QD) modulewhich includes a display panel and a driver for driving the displaypanel. The display apparatus may include a set electronic device or aset device (or a set apparatus) such as a laptop computer, a television,a computer monitor, an equipment apparatus including an automotiveapparatus or other type apparatuses for vehicles, or a mobile electronicdevice such as a smartphone or an electronic pad, which is a completeproduct (or a final product) including an LCM, an OLED module, a QDmodule, or the like.

Therefore, in the present specification, the display apparatus mayinclude a narrow-sense display apparatus itself, such as an LCM, an OLEDmodule, or a QD module and a set device which is an application productor a final consumer device including an LCM, an OLED module, a QDmodule, or the like.

In some cases, an LCM, an OLED module, or a QD module including adisplay panel, a driver, and the like may be referred to as a“narrow-sense display apparatus,” and an electronic device which is afinal product including an LCM, an OLED module, or a QD module may bereferred to as a “set device.” For example, the narrow-sense displayapparatus may include a display panel, such as a liquid crystal display(LCD), an OLED, or a QD display panel and a source printed circuit board(PCB) which is a controller for driving the display panel. The setdevice may further include a set PCB which is a set controllerelectrically connected to a source PCB to control the entirety of theset device.

As a display panel used in the present aspect, any type of display panelsuch as an LCD panel, an OLED display panel, or a QD display panel maybe used, but the present disclosure is not limited to a specific displaypanel which is bendable by including a flexible substrate for the OLEDdisplay panel and a back play support structure thereunder. A shape or asize of a display panel used in a display apparatus according to aspectsof the present specification is not limited.

More specifically, when the display panel is the OLED display panel, thedisplay panel may include a plurality of gate lines, a plurality of datalines, and pixels formed in intersection areas of the gate lines and thedata lines. The display panel may include an array including a thin filmtransistor which is an element for selectively applying a voltage toeach pixel, an OLED layer on the array, and an encapsulation substrateor encapsulation layer disposed on the array to cover the OLED layer.The encapsulation layer may protect the thin film transistor and theOLED layer from an external impact and may prevent moisture or oxygenfrom permeating into the OLED layer. A layer formed on the array mayinclude an inorganic light-emitting layer, for example, a nano-sizedmaterial layer, QDs, or the like.

In the present specification, FIG. 1 illustrates an exemplary OLEDdisplay panel 100 which may be integrated with components inside displayapparatuses.

FIG. 1 is a plan view illustrating the display panel 100 according to anaspect of the present specification. FIG. 1 illustrates the exemplaryOLED display panel 100 which may be integrated with components insidethe display apparatuses. Referring to FIG. 1 , in the OLED display panel100, a hole CH for a camera and a sensor may be formed inside a displayarea AA, thereby reducing a bezel area which is a non-display area andmaximizing the display area AA. A product designed to maximize a displayarea AA can be aesthetically preferred by maximizing an immersion levelof a user.

The hole CH for the camera and the sensor may be one hole as shown inFIG. 1 but is not limited thereto. The hole CH for the camera and thesensor may be variously formed. For example, one or two holes may beformed inside the display area AA. In this case, a camera may bedisposed in a first hole, and a distance sensor or a face recognitionsensor and a wide-angle camera may be disposed in a second hole.

FIG. 2 is an enlarged plan view of area A which is a portion of thedisplay area AA of the display panel 100 of FIG. 1 and illustrates aplanar shape of subpixels disposed in the display area AA.

In FIG. 2 , a plurality of anodes 151 may be disposed in the displayarea AA, and a bank 154 may fill an area between the anodes 151. Thebank 154 may be disposed to cover an edge of the anode 151 and may serveto define an emission area of the subpixel by allowing only a middlearea of the anode 151 to be in contact with an organic light-emittingstack. Spacers 155 may be disposed in a portion of an area in which thebank 154 is disposed. The spacers 155 may be disposed to have a constantdensity in the entire display panel 100. The spacer 155 may serve tosupport a mask such that the mask for deposition, which covers or opensan organic layer for each subpixel, is not in direct contact with thedisplay panel 100 when a deposition process is performed to form theorganic light-emitting stack. Although FIG. 2 illustrates a PenTile-typeplanar structure in which the subpixels are arranged in dot shapes, thepresent disclosure is not limited thereto, and a real-type planarstructure may also be used.

FIG. 3 is a cross-sectional view along line I-I′ of FIG. 2 whichillustrates the subpixel.

Referring to FIG. 3 , a substrate 101, a multi-buffer layer 102, and alower buffer layer 103 may be provided, and a first transistor 120 maybe disposed on the lower buffer layer 103. A lower gate insulating film104 may be disposed on a first semiconductor layer 123 constituting thefirst transistor 120 to insulate the first semiconductor layer 123 froma first gate electrode 122. A first lower interlayer insulating film 105and a second lower interlayer insulating film 106 may be sequentiallydisposed on the first gate electrode 122, and an upper buffer layer 107may be disposed.

The multi-buffer layer 102 may delay diffusion of moisture or oxygenpermeating into the substrate 10 and may be formed by alternatelystacking silicon nitride (SiN_(x)) and silicon oxide (SiO_(x)) at leastone time.

The lower buffer layer 103 may protect the first semiconductor layer 123and perform a function of blocking various types of defects introducedfrom the substrate. The lower buffer layer 103 may be made of a-Si,silicon nitride (SiN_(x)), silicon oxide (SiO_(x)), or the like.

The first semiconductor layer 123 of the first transistor 120 may beformed as a polycrystalline semiconductor layer and may include achannel region, a source region, and a drain region.

The polycrystalline semiconductor layer may have higher mobility than anamorphous semiconductor layer and an oxide semiconductor layer and thusmay have low power consumption and excellent reliability. Due to suchadvantages, the polycrystalline semiconductor layer may be used for adriving transistor.

The first gate electrode 122 may be disposed on the lower gateinsulating film 104 and may be disposed to overlap the firstsemiconductor layer 123.

A second transistor 130 may be disposed on the upper buffer layer 107,and a light blocking layer 136 may be disposed under an areacorresponding to the second transistor 130. Referring to FIG. 3 , thelight blocking layer 136 may be disposed on the first lower interlayerinsulating film 105 in the area corresponding to the second transistor130, and a second semiconductor layer 133 of the second transistor 130may be disposed on the second lower interlayer insulating film 106 andthe upper buffer layer 107 to overlap the light blocking layer 136. Anupper gate insulating film 137 may be disposed on the secondsemiconductor layer 133 to insulate a second gate electrode 132 from thesecond semiconductor layer 133, and then an upper interlayer insulatingfilm 108 may be disposed on the second gate electrode 132. The firstgate electrode 122 and the second gate electrode 132 may be formed as asingle layer or a multi-layer made of at least one selected from amongmolybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti),nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof, butthe present disclosure is not limited thereto.

The first and second lower interlayer insulating films 105 and 106 maybe formed as inorganic films having a higher hydrogen particle contentas compared with the upper interlayer insulating film 108. For example,the first and second lower interlayer insulating films 105 and 106 aremade of silicon nitride (SiN_(x)) formed through a deposition processusing NH₃ gas, and the upper interlayer insulating film 108 may be madeof silicon oxide (SiO_(x)). Hydrogen particles included in the first andsecond lower interlayer insulating films 105 and 106 may diffuse intothe polycrystalline semiconductor layer during a hydrogenation processto fill pores in the polycrystalline semiconductor layer with hydrogen.Accordingly, the polycrystalline semiconductor layer may be stabilized,thereby preventing degradation in characteristics of the firsttransistor 120. After an activation and hydrogenation process of thefirst semiconductor layer 123 of the first transistor 120, the secondsemiconductor layer 133 of the second transistor 130 may be formed, andin this case, the second semiconductor layer 133 may be made of an oxidesemiconductor. Since the second semiconductor layer 133 is not exposedto a high-temperature atmosphere of the activation and hydrogenationprocess of the first semiconductor layer 123, damage to the secondsemiconductor layer 133 can be prevented, thereby improving reliability.After the upper interlayer insulating film 108 is disposed, a firstsource contact hole 125S and a first drain contact hole 125D may beformed to correspond to the source region and the drain region of thefirst transistor, and a second source contact hole 135S and a seconddrain contact hole 135 d may be respectively formed to correspond to asource region and a drain region of the second transistor 130. Referringto FIG. 3 , the first source contact hole 125S and the first draincontact hole 125D may be continuously formed from the upper interlayerinsulating film 108 to the lower gate insulating film 104, and thesecond source contact hole 135S and the second drain contact hole 135Dmay also be formed in the second transistor 130. A first sourceelectrode 121 and a first drain electrode 124 corresponding to the firsttransistor 120 and a second source electrode 131 and a second drainelectrode 134 corresponding to the second transistor 130 can be formedat the same time, thereby reducing the number of times of processes offorming the source and drain electrodes of each of the first transistor120 and the second transistor 130.

The first source and drain electrodes 121 and 124 and the second sourceand drain electrodes 131 and 134 may be formed as a single layer or amulti-layer made of at least one selected from among molybdenum (Mo),aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni),neodymium (Nd), and copper (Cu), or an alloy thereof, but the presentdisclosure is not limited thereto. The first source and drain electrodes121 and 124 and the second source and drain electrodes 131 and 134 mayhave a three-layered structure. For example, the first source electrode121 may include a first layer 121 a, a second layer 121 b, and a thirdlayer 121 c, and other source and drain electrodes may have the samestructure as the first source electrode 121.

A storage capacitor 140 may be disposed between the first transistor 120and the second transistor 130. As shown in FIG. 3 , the storagecapacitor 140 may be formed by overlapping a storage lower electrode 141and a storage upper electrode 142 with the first lower interlayerinsulating film 105 interposed therebetween.

The storage lower electrode 141 may be positioned on the lower gateinsulating film 104, formed to be coplanar with the first gate electrode122, and made of the same material as the first gate electrode 122. Thestorage upper electrode 142 may be electrically connected to a pixelcircuit through a storage supply line 143. The storage upper electrode142 may be formed to be coplanar with the light blocking layer 136 andmade of the same material as the light blocking layer 136. The storageupper electrode 142 is exposed through a storage contact hole 144passing through the second lower interlayer insulating film 106, theupper buffer layer 107, the upper gate insulating film 137, and theupper interlayer insulating film 108 and is connected to the storagesupply line 143. Meanwhile, although the storage upper electrode 142 isspaced apart from the light blocking layer 136 as shown in FIG. 3 , thestorage upper electrode 142 may be connected to the light blocking layer136 to be formed integrally with the light blocking layer 136. Thestorage supply line 143 may be formed to be coplanar with the firstsource and drain electrodes 121 and 124 and the second source and drainelectrodes 131 and 134 and made of the same material as the first sourceand drain electrodes 121 and 124 and the second source and drainelectrodes 131 and 134. Accordingly, the storage supply line 143 may beformed simultaneously with the first source and drain electrodes 121 and124 and the second source and drain electrodes 131 and 134 through thesame mask process.

A protective film 109 may be formed by depositing an inorganicinsulating material such as SiN_(x) or SiO_(x) on an entire surface ofthe substrate 101 on which the first source and drain electrodes 121 and124, the second source and drain electrodes 131 and 134, and the storagesupply line 143 are formed. A first planarization layer 110 may beformed on the substrate 101 on which the protective film 109 is formed.Specifically, the first planarization layer 110 may be disposed byapplying an organic insulating material such as an acrylic resin ontothe entire surface of the substrate 101 on which the protective film 109is formed.

After the protective film 109 and the first planarization layer 110 arebe disposed, a contact hole exposing the first source electrode 121 orthe first drain electrode 124 of the first transistor 120 may be formedthrough a photolithography process. A connection electrode 145 made of amaterial including Mo, Ti, Cu, AlNd, Al, Cr, or an alloy thereof may bedisposed in an area of the contact hole exposing the first drainelectrode 124.

A second planarization layer 111 may be disposed on the connectionelectrode 145, and a contact hole exposing the connection electrode 145may be formed in the second planarization layer 111 to arrange alight-emitting element 150 connected to the first transistor 120.

The light-emitting element 150 may include the anode 151 connected tothe first drain electrode 124 of the first transistor 120, at least oneorganic light-emitting stack 152 formed on the anode 151, and a cathode153 formed on the organic light-emitting stack 152.

The organic light-emitting stack 152 may include a hole injection layer,a hole transport layer, an emission layer, an electron transport layer,and an electron injection layer, and in a tandem structure in which aplurality of emission layers overlap each other, a charge generationlayer may be additionally disposed between the emission layer and theemission layer. In some cases, the emission layer may emit light havingdifferent colors for each subpixel. For example, a red emission layer, agreen emission layer, and a blue emission layer may be separately formedfor each subpixel. However, a common emission layer may be formed toemit white light without color discrimination for each pixel, and acolor filter for discriminating colors may be separately provided. Thediscrimination may be classified into a red-green-blue (RGB) type (realRGB type) and a white OLED (WOLED). Each emission layer may beindividually formed, but the injection layer or the transport layer maybe provided as a common layer and may be equally disposed for eachsubpixel.

The anode 151 may be connected to the connection electrode 145 exposedthrough a contact hole passing through the second planarization layer111. The anode 151 may be formed in a multi-layered structure includinga transparent conductive film and an opaque conductive film having highreflection efficiency. The transparent conductive film is made of amaterial having a relatively large work function value, such asindium-tin-oxide (ITO) or indium-zinc-oxide (IZO), and the opaqueconductive film has a single-layered or multi-layered structureincluding Al, Ag, Cu, Pb, Mo, Ti, or an alloy thereof. For example, theanode 151 may be formed in a structure in which a transparent conductivefilm, an opaque conductive film, and a transparent conductive film aresequentially stacked or in a structure in which a transparent conductivefilm and an opaque conductive film are sequentially stacked. The anode151 may be disposed in the emission area provided by the bank 154 aswell as on the second planarization layer 111 to overlap a pixel circuitarea in which the first and second transistors 120 and 130 and thestorage capacitor 140 are disposed, thereby increasing an area foremitting light.

The organic light-emitting stack 152 may be formed by stacking the holetransport layer, the organic emission layer, and the electron transportlayer on the anode 151 in that order or in the reverse order. Inaddition, the organic light-emitting stack 152 may further include acharge generation layer and may include first and second light-emittingstacks facing each other with the charge generation layer interposedtherebetween.

The bank 154 may be formed to expose the anode 151. The bank 154 may bemade of an organic material such as photoacrylic and may include atranslucent material, but the present disclosure is not limited thereto.The bank 154 may be made of an opaque material to prevent lightinterference between the subpixels.

The cathode 153 may be formed on an upper surface of the organiclight-emitting stack 152 to face the anode 151 with the organiclight-emitting stack 152 interposed therebetween. When the cathode 153is applied to a top emission type organic light-emitting displayapparatus, the cathode 153 may be formed by forming a transparentconductive film to be thin using ITO, IZO, or magnesium-silver (Mg—Ag).

An encapsulation layer 170 for protecting the light-emitting element 150may be formed on the cathode 153. Since the light-emitting element 150reacts with external moisture or oxygen due to the characteristics of anorganic material of the organic light-emitting stack 152, dark-spots orpixel shrinkage may occur. In order to prevent the dark-spots or pixelshrinkage, the encapsulation layer 170 may be disposed on the cathode153. The encapsulation layer 170 may include a first inorganicinsulating film 171, a foreign material compensation layer 172, and asecond inorganic insulating film 173.

A touch unit may be disposed on an upper portion on which theencapsulation layer 170 is formed. The touch unit may include a firsttouch planarization layer, a touch electrode, and a second touchplanarization layer. The first touch planarization layer and the secondtouch planarization layer may be disposed to eliminate a stepped portionat a point at which the touch electrode is disposed and to allow thetouch electrode to be electrically insulated well.

FIG. 4 is an enlarged plan view of area B corresponding to a camera holearea CH of FIG. 1 . Referring to FIG. 4 , a camera hole CH for arranginga large-sized camera may be formed in a central portion, and a cameramodule may be disposed therein. The camera hole area CH may include allof a circular camera hole CH and areas, in which a dam structure 300 anda cut-out structure 200 are disposed, near the camera hole CH. Thecamera hole CH may be removed with a laser in a panel completionoperation. A non-display area NA may be positioned between the camerahole area CH and a display area AA, and a high potential power line PL,a gate line SL, and the like may be disposed. The dam structure 300 andthe cut-out structure 200 may be disposed around the camera hole CH.Referring to FIG. 4 , the dam structure 300 may include a first dam 301and a second dam 302, and the cut-out structure 200 may include a firstcut-out part 201 and a second cut-out part 202. The first dam 301, thefirst cut-out part 201, the second dam 302, and the second cut-out part202 may be sequentially disposed from a center of the camera hole CH. Ingeneral, a dam structure prevents a foreign material compensation layer172, which is a part of an encapsulation layer at an outer peripheralportion of a display panel 100, from flowing to an end of the outerperipheral portion of the display panel 100, thereby aiming to maintaina bonding strength between an upper substrate and a lower substrateconstituting the display panel 100. In order to prevent the foreignmaterial compensation layer 172 of an encapsulation layer 170 forprotecting a light-emitting element 150 from permeating or leaking intothe camera hole area CH, the dam structure 300 near the camera hole areaCH may also be formed as a plurality of structures such as the first dam301 and the second dam 302. In the present specification, two dams areprovided, but the present disclosure is not limited thereto. Anadditional dam may be disposed according to an arrangement of a space.Referring to FIG. 4 , the first cut-out part 201 and the second cut-outpart 202 may be disposed near the first dam 301 and the second dam 302.The first cut-out part 201 and the second cut-out part 202 may bedisposed to protect the light-emitting element 150 in the display areafrom moisture or oxygen that may flow from the camera hole CH. Anorganic light-emitting stack 152 for the light-emitting element 150 maybe deposited on an entire surface of the display panel 100 and may alsobe uniformly deposited near the camera hole area CH. The organiclight-emitting stack 152 may have high reactivity and communicabilitywith respect to moisture and oxygen due to the characteristics of anorganic material and thus may deliver moisture and oxygen to thelight-emitting element 150 in the display area AA. In order to preventthe delivering of moisture and oxygen, the first and second cut-outparts 201 and 202 may allow the organic light-emitting stack 152 to bepartially cut off. In the present specification, two cut-out structuresare described, but the present disclosure is not limited thereto.

Referring to FIG. 4 , a crack prevention structure 400 may be disposedbetween the first cut-out part 201 and the first dam 301. The camerahole CH may be formed in a substrate 101 of the display panel 100 toarrange a camera lens. A precision cutting process using a laser may beperformed on the substrate 101 to form the camera hole CH, and in thiscase, the laser may cause microcracks in the substrate 101. Themicrocracks generated in a cut surface of the camera hole CH may begradually expanded by stress accumulated as a subsequent module processis performed. Such cracks may be propagated from the non-display area NAto an adjacent display area AA. Due to the expansion of cracks, externaloxygen or moisture may reach the light-emitting element 150 in thedisplay area AA through the cracks, and the light-emitting element 150having organic characteristics may react with oxygen or moisture tocause a pixel shrinkage or dark spot phenomenon in a pixel in a specificarea, thereby causing display defects. In order to prevent the expansionof cracks, the crack prevention structure 400 for preventing theexpansion of cracks may be disposed near the camera hole CH.

The crack prevention structure 400 may have a structure in which aportion of an inorganic film, in which cracks easily expand, is removedin order to prevent the expansion of cracks generated in the cut surfaceof the camera hole CH.

All of the first cut-out part 201, the first dam 301, the second cut-outpart 202, and the second dam 302 may be disposed in a closed loop shapearound the camera hole CH. This is to prevent the penetration of oxygenand moisture at a certain distance from the cut surface of the camerahole CH and to prevent the foreign material compensation layer 172 ofthe encapsulation layer 170 from overflowing into the camera hole CH.

In addition, the crack prevention structure 400 may also be disposed tohave a closed loop shape around the camera hole CH. The crack preventionstructure 400 may be disposed to be well combined into a structure inwhich the first and second cut-out parts 201 and 202 and the first andsecond dams 301 and 302 are formed, and in order to smoothly perform acrack propagation prevention function, the crack prevention structure400 should form a perfect closed loop structure without an open portion.

Although a light-emitting element 150 and a pixel circuit are removedfrom a corresponding area in which the camera hole area CH is disposed,light-emitting elements 150 and pixel circuits disposed at upper, lower,left, and right sides of the camera hole area CH should be electricallyconnected. To this end, in the non-display area NA near the camera holearea CH, a high potential power line PL, a gate line SL, and the likemay be disposed to bypass the camera hole area CH so as to be connectedvertically and laterally.

FIG. 5 is an enlarged plan view of area C in the camera hole area CH ofFIG. 4 . Referring to FIG. 5 , the first cut-out part 201 may bedisposed between the camera hole CH and the first dam 301, and thesecond cut-out part 201 may be disposed between the first dam 301 andthe second dam 302.

The first cut-out part 201 may include a first structure 211, a secondstructure 212, a third structure 213, a fourth structure 214, a fifthstructure 215, a sixth structure 216, a seventh structure 217, an eighthstructure 218, and a ninth structure 219. The second cut-out part 202may include a tenth structure 221, an eleventh structure 222, a twelfthstructure 223, and a thirteenth structure 224.

Although FIG. 5 illustrates that there are nine structures in the firstcut-out part 201 and four structures in the second cut-out part 202, thepresent disclosure is not necessarily limited thereto, and variousnumbers of cut-out parts may be provided.

Referring to FIG. 5 , the crack prevention structure 400 may be formedin an area in which the structures of the first cut-out part 201 aredisposed. For example, the crack prevention structure 400 may bedisposed between the fifth structure 215 and the sixth structure 216.The crack prevention structure 400 may be disposed between the fifthstructure 215 and the sixth structure 216, which are not far from thecut surface of the camera hole CH, thereby preventing cracks, which maybe generated in the cut surface, from expanding to the first dam 310.

FIG. 6 is a cross-sectional view illustrating a cross section along lineIII-IV of FIG. 5 . Referring to FIG. 6 , it can be confirmed that thereis the substrate 101 of the display panel 100, and a plurality ofinorganic films are disposed on the substrate 101. As the plurality ofinorganic films, for example, a multi-buffer layer 102, a lower bufferlayer 103, and a lower gate insulating film 104 may be provided, and afirst lower interlayer insulating film 105, a second lower interlayerinsulating film 106, and an upper buffer layer 107 may be sequentiallydisposed.

A first planarization layer 110 and a second planarization layer 111 maybe disposed on the plurality of inorganic films, and a bank 154 and aspacer 155 may be sequentially disposed. The organic light-emittingstack 152 may be deposited on an entire surface to be disposed on thebank 154 and the spacer 155.

Regarding a cut plane along line it can be seen that the camera hole CHis close to point IV and the display area AA is close to area III.Regarding the cut plane along line in order to cut off the organiclight-emitting stack 152 which may become a moisture penetration path,the structures of the first cut-out part 201 may be formed in two stagesof an upper structure part and a lower structure part according to thecut surface of the camera hole CH. Specifically, the upper structurepart may be disposed such that a cross section thereof has a trapezoidalshape with a positive tapered shape, and the lower structure part may bedisposed such that a side surface thereof has a positive tapered shapeor a rectangular shape with an almost vertical constant height.

Since a difference in width or breadth occurs between a lower surface ofthe upper structure part and an upper surface of the lower structurepart, which are points at which the upper structure part and the lowerstructure part meet each other, an undercut structure may be formed onthe lower surface of the upper structure part. The lower structure partmay be formed of the second lower interlayer insulating film 106 and theupper buffer layer 107, and the upper structure part may be formed ofthe first planarization layer 110 and the second planarization layer111.

The upper structure part may be made of an organic material to form theundercut structure. The organic light-emitting stack 152 may bedeposited on the entire surface of the display panel 100 usingstraightness during deposition, but the organic light-emitting stack 152may be cut off because the organic light-emitting stack 152 cannot beformed on the lower surface of the upper structure part of the cut-outpart due to an undercut shape of the upper structure part of the cut-outpart.

The first cut-out part 201 and the second cut-out part 202 may includethe plurality of structures, thereby preventing oxygen and moisture frompermeating through the organic light-emitting stack 152. Although it isdescribed that the first cut-out part 201 has more structures than thesecond cut-out part 202, the present disclosure is not necessarilylimited thereto, and various changes may be applied.

Referring to FIG. 6 , the first dam 301 and the second dam 302 areillustrated and are formed in a separation space between the firstcut-out part 201 and the second cut-out part 202 and inside the secondcut-out part 202, respectively, thereby forming a kind of wall. Althoughnot shown in FIG. 6 , the foreign material compensation layer 172 of theencapsulation layer 170 may fill a space between the first dam 301 andthe second dam 302. The first dam 301 or the second dam 302 aims toprevent the foreign material compensation layer 172 of the encapsulationlayer 170 from overflowing to the camera hole CH and contaminating thecamera hole CH.

The crack prevention structure 400 is disposed between the fifthstructure 215 and the sixth structure 216 of the first cut-out part 201,thereby preventing cracks, which may be generated in the cut surface ofthe camera hole CH, from being propagated to the display area AA. Thecrack prevention structure 400 may be formed by arranging an organicmaterial including the first planarization layer 110 or the secondplanarization layer 111 in a space in which the multi-buffer layer 102,the lower buffer layer 103, the lower gate insulating film 104, thefirst lower interlayer insulating film 105, and the second lowerinterlayer insulating film 106 are removed among the plurality ofinorganic films disposed on the substrate 101 of the display panel 100.

In general, the substrate 101 may be perforated using a laser to formthe camera hole CH. The laser may radiate in a circular or ellipticalshape along a shape of the camera hole CH, and all areas on thesubstrate including the substrate 101 may be removed through laserradiation.

There may be a difference between the actual camera hole CH and a laserirradiation area, and for example, the laser irradiation area in thecamera hole CH may be an area at about 100 μm inside the camera hole CH.Only when there is a difference between the laser irradiation area andthe camera hole CH, an insulating layer of the camera hole CH may not bedamaged during laser radiation.

As a laser, a picosecond laser or a femtosecond laser may be used, butthe present disclosure is not limited thereto. A laser uses light thatis induced and emitted by amplifying light generated when energy isapplied to a specific material. The laser has the same characteristicsas radio waves and has characteristics of monochromatic light anddirectivity and thus is used for communication, medical, and industrialpurposes.

When a laser is used, a pattern can be formed on a desired part, or aspecific part can be easily removed. A laser is for forming or removinga pattern using energy, and when laser energy radiates onto a subject,thermal energy melts the subject to form a pattern. As a laser radiationtime increases, a thermal effect may occur in which heat is transmittedto the vicinity of a portion at which a pattern is formed. Due to thethermal effect, heat may be accumulated around a laser irradiation areaof the subject, and even a surrounding area greater than a set patternmay be burned or deformed by the heat.

Due to such characteristics of a laser, when an area onto which thelaser radiates overlaps an insulating film or is adjacent to theinsulating film, thermal energy of the laser may also cause deformationof the insulating film. Cracks may be generated due to the deformationof the insulating film, and the cracks may be propagated through theinsulating film to cause delamination, which may cause penetration ofmoisture and oxygen. For example, in order to prevent deformation ordelamination of insulating films such as the multi-buffer layer 102, thelower buffer layer 103, the first lower interlayer insulating film 105,the second lower interlayer insulating film 106, the upper buffer layer107, and the upper interlayer insulating film 108, all the insulatingfilms may be removed at a distance of about 100 μm from a laserradiation position.

When all the insulating films are removed, side surfaces of thesubstrate 101 and the insulating films may be exposed, but a firstinorganic insulating film 171 and a second inorganic insulating film 173of the encapsulation layer 170 may cover the side surfaces.

Cracks generated, when the substrate 101 is cut using a laser, havecharacteristics that are easily propagated through an inorganic film.Moisture and oxygen have characteristics that are delivered by reactingwith the organic light-emitting stack 152, but cracks may be easilypropagated through non-flexible and hard inorganic films. The crackprevention structure 400 may be designed based on such crack propagationcharacteristics.

An exposed area of the substrate 101 may be formed by removing themulti-buffer layer 102, the lower buffer layer 103, the lower gateinsulating film 104, the first lower interlayer insulating film 105, andthe second lower interlayer insulating film 106 among the plurality ofinorganic films disposed on the substrate 101, and then, the firstplanarization layer 110 or the second planarization layer 111 may bedisposed to cover the exposed area of the substrate and side exposedportions of the plurality of inorganic films.

The plurality of inorganic films may be removed to expose the substrate101, and the crack prevention structure 400 made of an organic materialmay cover an area in which the plurality of inorganic films are removedso that cracks generated in the camera hole CH may be absorbed by thecrack prevention structure 400.

The crack prevention structure 400 may be divided into an upperstructure part 401 and a lower structure part 402. The upper structurepart 401 may have a width greater than that of the structuresconstituting the first cut-out part 201 or the second cut-out part 202,and the lower structure part 402 may have a width less than that of thefirst cut-out part 201 or the second cut-out part 202.

Referring to FIG. 6 , as for a shape of the crack prevention structure400, the lower structure part 402 may have an inverted trapezoidal shapein which an inorganic film removal portion of the multi-buffer layer 102is the narrowest and inorganic film removal portions are widened in theorder from the lower buffer layer 103, the lower gate insulating film104, the first lower interlayer insulating film 105, and the secondlower interlayer insulating film 106.

Since there is a high probability that cracks are generated in the firstlower interlayer insulating film 105 and the second lower interlayerinsulating film 106 with which a laser first comes into contact in thecamera hole CH of the display panel 100, the lower structure part 402 ofthe crack prevention structure 400 may be formed such that the firstlower interlayer insulating film 105 and the second lower interlayerinsulating film 106 may be widely removed.

The upper structure part 401 of the crack prevention structure 400 maysufficiently cover the lower structure part 402 of the crack preventionstructure 400 so that removed portions of the plurality of inorganicfilms on the substrate 101 may not be exposed.

Accordingly, the upper structure part 401 of the crack preventionstructure 400 may have a trapezoidal shape with a wide lower portion anda narrow upper portion. Referring to FIG. 6 , when viewed in across-sectional structure, the crack prevention structure 400 may bedivided into the upper structure part 401 and the lower structure part402, and when viewed in a planar structure, the crack preventionstructure 400 forms an annular closed loop spaced a certain distanceapart from the camera hole CH.

FIG. 7 is a cross-sectional view illustrating an arrangement of a crackprevention structure according to another aspect of the presentdisclosure. Referring to FIG. 7 , a crack prevention structure 400 maybe formed in an area in which a second cut-out part 202 is disposed.Unlike the aspect of FIG. 6 , a design structure of another aspect isdedicated to preventing penetration of oxygen and moisture through anorganic light-emitting stack 152 by arranging the crack preventionstructure 400 close to a display area AA, and continuously arranging afirst cut-out part 201 near the camera hole CH. In addition, as cracksstarting from the camera hole CH are propagated to a side surface, thestrength of the cracks may be gradually decreased, thereby serving toprevent the cracks at a front end of the display area AA. Referring toFIG. 7 , like the aspect of FIG. 6 , in the crack prevention structure400, an upper structure part 401 and a lower structure part 402 may bedisposed, and the upper structure part 401 may have a trapezoidal shape,and the lower structure part 402 may have an inverted trapezoidal shape.

FIG. 8 is a cross-sectional view illustrating an arrangement of a crackprevention structure 400 according to still another aspect of thepresent disclosure.

Referring to FIG. 8 , the crack prevention structure 400 is disposed ineach of a first cut-out part 201 and a second cut-out part 202, therebyserving to doubly block cracks, which may be generated in a camera holeCH, from approaching a display area AA.

As in the other aspects, the crack prevention structure 400 of FIG. 8may have a structure in which portions of a plurality of inorganic filmson a substrate 101 are removed to form an upper structure part 401 and alower structure part 402.

A first crack prevention structure 410 may be disposed in the firstcut-out part 201, and a second crack prevention structure 420 may bedisposed in the second cut-out part 202. When the plurality of crackprevention structures are disposed as described above, there is anadvantage in that cracks passing through the first crack preventionstructure 410 can be prevented from being propagated to the display areaAA through the second crack prevention structure 420.

When it is determined that penetration of moisture and oxygen into thedisplay area AA through an organic light-emitting stack 152 can besufficiently prevented, a partial area of each of the first cut-out part201 and the second cut-out part 202 may be converted into an area inwhich the crack prevention structure 400 is disposed.

FIG. 9 is a cross-sectional view illustrating an arrangement of a crackprevention structure 400 according to yet another aspect of the presentdisclosure.

Referring to FIG. 9 , the crack prevention structure 400 having a sizegreater than that of the crack prevention structure 400 of FIG. 6 may bedisposed in a first cut-out part 201. For example, the crack preventionstructure 400 of FIG. 9 may have a width that is about twice a width ofthe crack prevention structure 400 of other aspects.

When the crack prevention structure 400 of other aspects may have awidth of about 20 μm, the crack prevention structure 400 of FIG. 9 mayhave a width of about 40 μm.

When cracks having high energy are generated in a camera hole CH by astronger impact, a phenomenon may occur in which the cracks pass thoughthe crack prevention structure 400 of the existing aspect tocontinuously propagate. In order to prevent the phenomenon, an area, inwhich a plurality of inorganic films on a substrate 101 are removed, maybe more than doubled to expand a lower structure part 402 of the crackprevention structure 400.

Accordingly, even when cracks having high energy are generated, it ispossible to prevent the cracks from propagating to the display area AA.The crack prevention structure 400 of FIG. 9 may have a width that istwo or three times that of a structure of the first cut-out part 201.

FIG. 10 is a cross-sectional view illustrating an arrangement of a crackprevention structure 400 according to yet another aspect of the presentdisclosure.

Referring to FIG. 10 , the crack prevention structure 400 may have ashape in which only a lower gate insulating film 104 is removed so thatan upper surface of a lower buffer layer 103 is in contact with a lowerstructure part 402 of the crack prevention structure 400.

There is a high probability that cracks are generated in a first lowerinterlayer insulating film 105 and a second lower interlayer insulatingfilm 106 with which a laser first comes into contact in a process offorming a camera hole CH.

When, in addition to a first lower interlayer insulating film 105 and asecond lower interlayer insulating film 106 having a high probability ofthe generation of cracks among a plurality of inorganic films, a lowergate insulating film 104 is further removed to form the lower structurepart 402 of the crack prevention structure 400, there are advantages inthat crack propagation with a high probability can be prevented andalso, a structure can be easily formed because there are a relativelysmall number of inorganic films to be removed.

In the aspect of FIG. 10 , it is possible to minimize quality problemsthat may occur in a process of removing a structure of a first cut-outpart 201 and the plurality of inorganic insulating films.

FIG. 11 is a cross-sectional view illustrating an arrangement of a crackprevention structure 400 according to yet another aspect of the presentdisclosure.

Referring to FIG. 11 , the crack prevention structure 400 of FIG. 11 mayhave a shape in which an area in which a substrate 101 is exposed isminimized to leave a portion of a plurality of inorganic films andremove a portion of the plurality of inorganic films. For example, theplurality of inorganic films may be removed in an area close to a camerahole CH to expose the substrate 101, and the plurality of inorganicfilms may be removed again to remove the substrate 101 in an area spaceda certain distance apart from the area close to the camera hole CH.

A first lower structure part 402 and a second lower structure part 403of the crack prevention structure 400 may be disposed in the areas tofill the areas in which the plurality of inorganic insulating films areremoved, and an upper structure part 401 may be disposed to connect thetwo areas.

Through such a structure, the plurality of inorganic insulating filmsremaining inside the crack prevention structure 400 may form one wall toprevent crack expansion.

In the propagation of cracks, when the cracks reach the crack preventionstructure 400, the cracks should meet a second lower structure part 403to pass through an interface and should cross a remaining inorganic filmwall again to pass through the first lower structure part 402, and thus,there may be an advantage in preventing the propagation of the cracks.

Referring to FIG. 11 , a cross-sectional shape of the crack preventionstructure 400 is similar to that of a root of a tooth, and thus, therebyimproving a bonding strength or durability between a display panel 100and the crack prevention structure 400.

FIG. 12 is a cross-sectional view illustrating an arrangement of a crackprevention structure 400 according to yet another aspect of the presentdisclosure.

Referring to FIG. 12 , a structure of the crack prevention structure 400according to the aspect of FIG. 11 may be modified to form two wallswhich are formed of a plurality of inorganic films, and an area in whichportions of the plurality of inorganic layers are removed may be formedto form three lower structure parts.

As in the aspect of FIG. 11 , the present aspect is an aspect in whichthe plurality of inorganic films and a third lower structure part 404constituting the crack prevention structure 400 are added, and ascompared with the aspect of FIG. 11 , the crack prevention structure 400has a structure in which one inorganic film wall and one organic filmwall are further formed. Thus, the crack prevention structure 400 can bemore effective in preventing the propagation of cracks.

When cracks are propagated to reach the crack prevention structure 400,the cracks should pass through three lower structure parts, for example,the third lower structure part 404, a second lower structure part 403, afirst lower structure part 402, and an inorganic film wall disposedbetween the lower structure parts, it is possible to reduce apossibility of crack propagation.

FIG. 13 is a cross-sectional view illustrating an arrangement of a crackprevention structure 400 according to yet another aspect of the presentdisclosure.

Referring to FIG. 13 , the crack prevention structure 400 of FIG. 13 maybe formed to have a structure in which a structure of the crackprevention structure 400 of FIG. 12 is changed to remove a plurality ofinorganic films up to a lower gate insulating film 104 at a pointadjacent to a camera hole CH and a point adjacent to a display area AAand remove the plurality of inorganic films up to an upper portion of asubstrate 101 between the two points.

When the crack prevention structure 400 is disposed in areas of theremoved inorganic layers, a first lower structure part 402 and a thirdlower structure part 404 may be disposed in areas in which the inorganiclayers are removed up to the lower gate insulating film 104, and asecond lower structure part 403 may be disposed between the first lowerstructure part 402 and the third lower structure part 404.

The first lower structure part 402 and the third lower structure part404 of the crack prevention structure 400 can prevent crack propagationfrom a first lower interlayer insulating film 105 or a second lowerinterlayer insulating film 106 having a high possibility of thegeneration of cracks, and also, a process of removing the inorganicfilms up to an upper surface of the substrate 101 can be omitted.

The second lower structure part 403 of the crack prevention structure400 may prevent cracks from propagating to a multi-buffer layer 102 or alower buffer layer 103.

In the present aspect, the lower structure parts of the crack preventionstructure 400 are differently disposed, thereby preventing crackspropagating through various paths, and at the same time, the crackprevention structure 400 is allowed to have a sufficient size, therebypreventing the propagation of cracks with various strengths.

FIG. 14 is a cross-sectional view illustrating an arrangement of a crackprevention structure 400 according to yet another aspect of the presentdisclosure.

Referring to FIG. 14 , as in that shown in FIG. 8 , a first crackprevention structure 410 and a second crack prevention structure 420 aredisposed in a first cut-out part 201 and a second cut-out part 202. Thepresent aspect is different from the aspect of FIG. 8 in that the firstcrack prevention structure 410 disposed in the first cut-out part 201may include a plurality of lower structure parts, for example, a firstlower structure part 402 and a second lower structure part 403.

Since the first crack prevention structure 410 is further disposedadjacent to a camera hole CH in addition to the second crack preventionstructure 420 adjacent to a display area AA, it is possible to preventcracks with various paths and high strength.

In addition, referring to FIG. 14 , the first crack prevention structure410 may be disposed adjacent to a first dam 301 so that structures ofthe first cut-out part 201 can be consecutively disposed near the camerahole CH. This may be a method for more effectively responding to thepenetration of oxygen and moisture through an organic light-emittingstack 152 from the external camera hole CH and may be achieved byconsecutively arranging six or eight or more structures of the firstcut-out part 201.

The structures of the first cut-out part 201 are densely disposed toprevent the penetration of oxygen and moisture, and at the same time,the first crack prevention structure 410 is allowed to include the firstlower structure part 402 and the second lower structure part 403,thereby preventing cracks from propagating to the display area AA.

FIG. 15 is a cross-sectional view illustrating an arrangement of a crackprevention structure 400 according to yet another aspect of the presentdisclosure. Referring to FIG. 15 , a first crack prevention structure410 and a second crack prevention structure 420 are disposed in a firstcut-out part 201, thereby serving to completely block cracks that mayoccur in a camera hole CH.

The first crack prevention structure 410 and the second crack preventionstructure 420 are sequentially disposed in the first cut-out part 201that is as far away from a display area AA as possible and is closest tothe camera hole CH, thereby minimizing an influence on the display areaAA.

The first crack prevention structure 410 may be allowed to include twolower structure parts as in the aspect of FIG. 11 and may be disposedsuch that it is difficult for cracks generated in the camera hole CH topass through interfaces of the first lower structure part 402 and thesecond lower structure part 403.

Although a display apparatus according to an aspect of the presentspecification has been described based on the fact that a substratecorresponding to a camera hole CH is removed by a laser, the presentdisclosure is not necessarily limited thereto, and a component of thesubstrate or only a portion of the substrate may be removed.

A display apparatus according to an aspect of the present specificationmay include an LCD, a field emission display device (FED), an OLEDdisplay device, and a QD display device.

The display apparatus according to the aspect of the presentspecification may include a set electronic device/apparatus or a setdevice (or a set apparatus) such as a laptop computer, a television, acomputer monitor, an equipment display apparatus including an automotivedisplay apparatus or another type apparatuses for vehicles, or a mobileelectronic device/apparatus such as a smartphone or an electronic pad,which is a complete product (or a final product) including an LCM, anOLED module, or the like.

A display apparatus according to an aspect of the present specificationmay be described as follows.

A display apparatus according to an aspect of the present specificationmay include a substrate including a display area, a camera hole, and anon-display area disposed between the display area and the camera hole,a light-emitting element disposed in the display area, one or morecut-out parts and at least one dam disposed in the non-display area, aplurality of insulating films disposed on the substrate and disposedunder the light-emitting element, the cut-out part, and the dam, and oneor more crack prevention structures disposed between the at least onedam and the camera hole.

In the display apparatus according to the aspect of the presentspecification, each crack prevention structure may include an upperstructure part and one or more lower structure parts.

In the display apparatus according to the aspect of the presentspecification, the plurality of insulating films may include amulti-buffer layer and a lower buffer layer.

The display apparatus according to the aspect of the presentspecification may include areas in which the substrate is exposed byremoving the multi-buffer layer and the lower buffer layer in thenon-display area.

In the display apparatus according to the aspect of the presentspecification, the one or more lower structure parts of the crackprevention structure may be disposed in the areas in which the substrateis exposed. The upper structure part of the crack prevention structuremay be disposed on the one or more lower structure parts.

In other words, in the display apparatus according to the aspect of thepresent specification, at least one of the multi-buffer layer and thelower buffer layer may include one or more openings in the non-displayarea.

The one or more lower structure parts of the crack prevention structuremay be positioned inside the openings. The upper structure part of thecrack prevention structure may be disposed on the one or more lowerstructure parts.

In the display apparatus according to the aspect of the presentspecification, the plurality of insulating films may include a gateinsulating film and an interlayer insulating film.

In the display apparatus according to the aspect of the presentspecification, the one or more lower structure parts of the crackprevention structure may be disposed in areas in which the gateinsulating film and the interlayer insulating film are removed in thenon-display area. The upper structure part of the crack preventionstructure may be disposed on the one or more lower structure parts.

In other words, in the display apparatus according to the aspect of thepresent specification, at least one of the gate insulating film and theinterlayer insulating film may include one or more openings in thenon-display area.

The one or more lower structure parts of the crack prevention structuremay be positioned inside the openings. The upper structure part of thecrack prevention structure may be disposed on the one or more lowerstructure parts.

In the display apparatus according to the aspect of the presentspecification, a first cut-out part of the one or more cut-out parts maybe disposed between the at least one dam and the camera hole.

In the display apparatus according to the aspect of the presentspecification, a second cut-out part of the one or more cut-out partsmay be disposed between the at least one dam and the display area.

In the display apparatus according to the aspect of the presentspecification, the crack prevention structure may be disposed in thefirst cut-out part.

In the display apparatus according to the aspect of the presentspecification, the crack prevention structure may be disposed in thesecond cut-out part.

A display apparatus according to an aspect of the present specificationmay include a substrate including a non-display area disposed between acamera hole and a display area, a plurality of inorganic insulatingfilms disposed in the display area and the non-display area, an organiclight-emitting stack disposed on the plurality of inorganic insulatingfilms to correspond to the display area, one or more cut-out parts andat least one dam disposed on the plurality of inorganic insulating filmsto correspond to the non-display area, and a crack prevention structuredisposed in the one or more cut-out parts.

In the display apparatus according to the aspect of the presentspecification, the crack prevention structure may include an upperstructure part and one or more lower structure parts.

In the display apparatus according to the aspect of the presentspecification, the plurality of inorganic insulating films may include amulti-buffer layer and a lower buffer layer.

The display apparatus according to the aspect of the presentspecification may include areas in which the substrate is exposed byremoving the multi-buffer layer and the lower buffer layer in thenon-display area.

In the display apparatus according to the aspect of the presentspecification, the one or more lower structure parts of the crackprevention structure may be disposed in the areas in which the substrateis exposed. The upper structure part of the crack prevention structuremay be disposed on the one or more lower structure parts.

In other words, in the display apparatus according to the aspect of thepresent specification, at least one of the multi-buffer layer and thelower buffer layer may include one or more openings in the non-displayarea.

The one or more lower structure parts of the crack prevention structuremay be positioned inside the openings. The upper structure part of thecrack prevention structure may be disposed on the one or more lowerstructure parts.

In the display apparatus according to the aspect of the presentspecification, the plurality of inorganic insulating films may include agate insulating film and an interlayer insulating film.

In the display apparatus according to the aspect of the presentspecification, the one or more lower structure parts of the crackprevention structure may be disposed in areas in which the gateinsulating film and the interlayer insulating film are removed in thenon-display area. The upper structure part of the crack preventionstructure may be disposed on the one or more lower structure parts.

In other words, in the display apparatus according to the aspect of thepresent specification, at least one of the gate insulating film and theinterlayer insulating film may include one or more openings in thenon-display area.

The one or more lower structure parts of the crack prevention structuremay be positioned inside the openings. The upper structure part of thecrack prevention structure may be disposed on the one or more lowerstructure parts.

In the display apparatus according to the aspect of the presentspecification, a first cut-out part of the one or more cut-out parts maybe disposed between the at least one dam and the camera hole.

In the display apparatus according to the aspect of the presentspecification, a second cut-out part of the one or more cut-out partsmay be disposed between the at least one dam and the display area.

In the display apparatus according to the aspect of the presentspecification, the crack prevention structure may be disposed in thefirst cut-out part.

The features, structures, and effects described above in the examples ofthe present application are included in at least one example of thepresent application, but the present disclosure is not limited to onlyone example. Furthermore, the features, structures, and effect describedin at least one example of the present application may be implementedthrough combinations or modifications of other examples by those skilledin the art to which the present application belongs. Therefore, contentassociated with the combinations and modifications should be construedas being within the scope of the present application.

It will be apparent to those skilled in the art to which the presentapplication belongs that the present application is not limited to theabove-described aspects and the accompanying drawings and varioussubstitutions, modifications, and variations can be made withoutdeparting from the spirit or scope of the present application. Thus, thescope of the present application is defined by the claims describedbelow, and the present application should be construed to cover allmodifications or variations induced from the meaning and scope of theappended claims and their equivalents.

What is claimed is:
 1. A display apparatus comprising: a substrateincluding a display area, a camera hole, and a non-display area betweenthe display area and the camera hole; a light-emitting element disposedin the display area; one or more cut-out parts and at least one damdisposed in the non-display area; a plurality of insulating filmsdisposed on the substrate and disposed under the light-emitting element,the cut-out parts, and the dam; and a crack prevention structuredisposed between the at least one dam and the camera hole.
 2. Thedisplay apparatus of claim 1, wherein the crack prevention structurecomprises an upper structure part and one or more lower structure parts.3. The display apparatus of claim 2, wherein the plurality of insulatingfilms comprise a multi-buffer layer and a lower buffer layer.
 4. Thedisplay apparatus of claim 3, wherein the substrate has an area exposedby removing the multi-buffer layer and the lower buffer layer in thenon-display area.
 5. The display apparatus of claim 4, wherein the oneor more lower structure parts of the crack prevention structure aredisposed in the area in which the substrate is exposed; and the upperstructure part of the crack prevention structure is disposed on the oneor more lower structure parts.
 6. The display apparatus of claim 2,wherein the plurality of insulating films comprise a gate insulatingfilm and an interlayer insulating film.
 7. The display apparatus ofclaim 6, wherein the one or more lower structure parts of the crackprevention structure are disposed in an area in which the gateinsulating film and the interlayer insulating film are removed in thenon-display area; and the upper structure part of the crack preventionstructure is disposed on the one or more lower structure parts.
 8. Thedisplay apparatus of claim 1, wherein the one or more cut-out partscomprise: a first cut-out part of the one or more cut-out parts isdisposed between the at least one dam and the camera hole; and a secondcut-out part of the one or more cut-out parts is disposed between the atleast one dam and the display area.
 9. The display apparatus of claim 8,wherein the crack prevention structure is disposed in the first cut-outpart.
 10. The display apparatus of claim 8, wherein the crack preventionstructure is disposed in the second cut-out part.
 11. A displayapparatus comprising: a substrate comprising a non-display area disposedbetween a camera hole and a display area; a plurality of inorganicinsulating films disposed in the display area and the non-display area;an organic light-emitting stack disposed on the plurality of inorganicinsulating films to correspond to the display area; one or more cut-outparts and at least one dam disposed on the plurality of inorganicinsulating films to correspond to the non-display area; and a crackprevention structure disposed in the one or more cut-out parts.
 12. Thedisplay apparatus of claim 11, wherein the crack prevention structurecomprises an upper structure part and one or more lower structure parts.13. The display apparatus of claim 12, wherein the plurality ofinorganic insulating films comprise a multi-buffer layer and a lowerbuffer layer.
 14. The display apparatus of claim 13, wherein thesubstrate has an area exposed by removing the multi-buffer layer and thelower buffer layer in the non-display area.
 15. The display apparatus ofclaim 14, wherein the one or more lower structure parts of the crackprevention structure are disposed in the area in which the substrate isexposed; and the upper structure part of the crack prevention structureis disposed on the one or more lower structure parts.
 16. The displayapparatus of claim 12, wherein the plurality of inorganic insulatingfilms comprise a gate insulating film and an interlayer insulating film.17. The display apparatus of claim 16, wherein the one or more lowerstructure parts of the crack prevention structure are disposed in anarea in which the gate insulating film and the interlayer insulatingfilm are removed in the non-display area; and the upper structure partof the crack prevention structure is disposed on the one or more lowerstructure parts.
 18. The display apparatus of claim 11, wherein the oneor more cut-out parts comprise: a first cut-out part of the one or morecut-out parts is disposed between the at least one dam and the camerahole; and a second cut-out part of the one or more cut-out parts isdisposed between the at least one dam and the display area.
 19. Thedisplay apparatus of claim 18, wherein the crack prevention structure isdisposed in the first cut-out part.